When a component fails during test or out in the field and the reason is not obvious then ESD is often citied as the culprit. However, some semiconductor manufacturers suggest that EOS is more likely to be the cause.
So what's the difference between Electrostatic Discharge (ESD) and Electrical Overstress (EOS)?
ESD typically lasts for only a few nanoseconds and can be of a very high voltage, whilst EOS is a much lower voltage it can last for a much longer time. EOS is not new, it has been around for a very long time but it is becoming more common as a failure mechanism due to the increasing sensitivity of modern components.
EOS can be caused by a large variety of equipment; soldering irons, test instruments and power supplies for example, and poor grounding is often the source of the trouble.
IPC-A-610 and IPC-7711 standards both give good advice on how to minimise the effects of EOS during assembly and rework respectively.
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